AI EXPOSURE
TSMC
Nearly impossible to route around. Files under IFRS as a foreign private issuer, so the derived figures below are not available from SEC data.
AllFactsAI holds no position in TSMC (TSM), as at 14 October 2026.
58%
High performance computing platform, 58% of 2025 revenue
7 blocks locked
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EVERY FACT WE HAVE ON TSMC
- TSMC, which fabricates nearly every leading-edge AI accelerator, reported September 2026 consolidated revenue of NT$511.86 billion, up 54.6% year-over-year — pushing its cumulative revenue for the first nine months of 2026 to NT$3.899 trillion, up 41.1% year-over-yearSeptember 2026 · Source TSMC
- TSMC's revenue for August 2026 reached NT$514.81 billion, up 53.3% year-over-year and 10.1% from July, taking its January-through-August 2026 total to NT$3,386.87 billion, up 39.3% from the same period in 2025 NT$514.81 billion in August revenue, up 53.3% year-over-yearAugust 2026 · Source TSMC
- TSMC's capital expenditure reached about US$15.7 billion in the second quarter of 2026, up 66.9% year-over-year, as the foundry ramps AI chip capacity TSMC spent about US$15.7 billion on capex in Q2 2026 alone, up 67% year-over-yearQ2 2026 · Source TSMC (SEC Form 6-K, Ex-99.2)
- TSMC's most advanced process nodes — 7-nanometer and finer, the technology AI accelerators and other leading-edge chips require — made up 77% of the foundry's total wafer revenue in the quarter ended June 30, 2026 77% of TSMC's wafer revenue from 7nm-and-below chipsQ2 2026 · Source TSMC Q2 2026 earnings release
- TSMC's high performance computing platform, the category that carries AI accelerators, accounted for 58% of its 2025 revenue2025 · Source TSMC 4Q25 management report
- Every AI accelerator queues for CoWoS, TSMC's advanced chip-packaging step, before it can ship. TrendForce estimates TSMC's monthly CoWoS capacity will hit a record in 2026, reaching as much as 140,000 wafers a monthJune 2026 · Source TrendForce
- AI chips are outrunning air cooling. TSMC's advanced-packaging R&D director told TrendForce that total package power for AI systems will rise roughly sixfold between 2024 and 2029, climbing from about 600 watts to 4,100 watts, pushing TSMC toward chip-level microchannel coolingSeptember 2026 · Source TrendForce
- TrendForce reports TSMC is racing to keep up with AI chip orders from Nvidia, AMD and Broadcom -- monthly 3-nanometer wafer starts, already near 150,000 in the first half of 2026, could reach 180,000 wafers a month by early Q4 2026Aug 2026 · Source TrendForce
- Every advanced AI chip needs 2.5D packaging before it ships, and TSMC's CoWoS lines have been the industry's tightest bottleneck. TrendForce expects the shortfall between what customers want and what TSMC can supply to ease as capacity ramps toward 200,000 wafers a month industry-wide, narrowing by the end of 2026 from TSMC's CoWoS supply-demand gap narrowing from about 20% to roughly 10% by the end of 2026June 2026 forecast · Source TrendForce
- TrendForce forecasts that global foundry industry revenue will grow 24.8% year-over-year to approximately $218.8 billion in 2026, with TSMC posting the largest increase of around 32% Global foundry revenue forecast to grow 24.8% to $218.8 billionpublished March 2026 · Source TrendForce
- In the first quarter of 2026, TSMC's share of revenue across the world's ten largest foundries reached 72%Q1 2026 · Source TrendForce