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Amkor Technology, the outsourced chip packaging and test house scaling up advanced packaging for AI processors, reported record second-quarter 2026 net sales of $1.90 billion, up 26% year-over-year $1.90 billion in record Q2 net sales, +26% YoY

Every advanced AI chip needs packaging and testing before it ships, and ASE Technology, the world's largest outsourced semiconductor packaging and test house, is racing to add capacity for it. Equipment spending in its packaging and test segment jumped in the quarter to 30 June 2026, from $942 million a year earlier to $1.646 billion in ASE's advanced-packaging equipment spending, up 74.7% year-over-year

Every advanced AI chip is printed on an ASML machine, and the company says AI demand has its customers accelerating their expansion plans. On 15 July 2026 ASML said it would lift its 2026 low-NA EUV capacity of around 65 systems, for 2027, by 30% more EUV machines a year

AI inference is consuming NAND flash faster than suppliers can allocate it. Enterprise SSD contract prices rose roughly 80% in the first quarter of 2026, and on TrendForce's count the top five brands' combined revenue hit a record $18.46 billion — enterprise SSD revenue rose 86.1% in a single quarter

High-bandwidth memory is taking over the memory industry's capacity: TrendForce expects HBM to account, among the top three DRAM suppliers by the end of 2026, for 22% of DRAM wafer input, up from 18% a year earlier

Nvidia's accelerators have pushed thermal design power from 700W for the H100 to over 1,000W for the B200 and B300, and air can no longer carry the heat away. TrendForce expects liquid cooling in server racks to reach 47% of server racks by 2026

Lam Research, whose machines etch and deposit the layers inside AI chips, reported fiscal 2026 revenue of $23.23 billion — up 26% from $18.44 billion in fiscal 2025 — as CEO Tim Archer credited AI-driven demand for record margins and EPS $23.23 billion in fiscal 2026 revenue

Onto Innovation's inspection systems qualify the 2.5D packaging and high-bandwidth memory built into every AI accelerator, and that demand pushed its Specialty Devices and Advanced Packaging segment to an all-time high. Total company revenue in the quarter ended 30 June 2026 reached $343.1 million in quarterly revenue, up 35.3% year-over-year

Samsung is racing to keep pace with HBM4 demand for Nvidia's next GPU generation, and TrendForce reports the company plans to lift its HBM wafer output from about 170,000 wafers a month to roughly 250,000 wafers a month by the end of 2026, a jump of about 47%

US cloud providers signed multi-year supply agreements that stop memory makers raising their prices, so TrendForce expects the third-quarter 2026 increase to fall on everyone else: server DRAM contract prices up another 13–18% in one quarter

Orders for Nvidia rack-scale platforms and in-house cloud ASICs came in stronger than expected, so in August 2026 TrendForce revised its forecast for this year's global AI server shipments up from 28% growth to nearly 31% growth year-on-year

TrendForce forecasts that global foundry industry revenue will grow 24.8% year-over-year to approximately $218.8 billion in 2026, with TSMC posting the largest increase of around 32% Global foundry revenue forecast to grow 24.8% to $218.8 billion

AI servers have repriced memory faster than any forecast could keep up with. In a single quarter TrendForce raised its estimate for 2026 global memory market revenue from $551.6 billion to $889.3 billion — 61% above its own forecast from three months earlier

TSMC's high performance computing platform, the category that carries AI accelerators, accounted for 58% of its 2025 revenue

In the first quarter of 2026, TSMC's share of revenue across the world's ten largest foundries reached 72%

Vertiv, which builds data-centre power and cooling, ended 2025 with an order backlog of $15.0 billion — up 109% in a year