AI chips are outrunning air cooling. TSMC's advanced-packaging R&D director told TrendForce that total package power for AI systems will rise roughly sixfold between 2024 and 2029, climbing from about 600 watts to 4,100 watts, pushing TSMC toward chip-level microchannel cooling
TSMC's Advanced Packaging R&D Director presented these projections at SEMICON Taiwan 2026, as reported by TrendForce. Total package power for AI systems is expected to rise from about 600 watts in 2024 to 4,100 watts by 2029. TSMC is exploring chip-level microchannel cooling to handle the extra heat.
Verified 2026-09-25
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Hotter AI chips need new cooling methods, which affects data-centre design and the firms that supply cooling.
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