Back
Supply chain6/day by emailReported
AI chips are outrunning air cooling. TSMC's advanced-packaging R&D director told TrendForce that total package power for AI systems will rise roughly sixfold between 2024 and 2029, climbing from about 600 watts to 4,100 watts, pushing TSMC toward chip-level microchannel cooling
Verified 2026-09-25
THE INTELLIGENCE CLUB
Facts like this, six days a week
The Daily Receipts on weekdays, The Weekly Brief on Saturday — six sourced facts a day by email, two more than the free site shows. Every one traced to the filing it came from. Free.
Free forever. Six emails a week — The Daily Receipts on weekdays, The Weekly Brief on Saturday — drop either in one click.
Read this morning's edition →TSMC’s exposure cardWhat share of the business the AI build-out actually isThe screener · 72 companiesEvery layer of the AI chain, priced dailyHow this was verifiedEvery figure links to the filing it came from
More on Supply chain
- TrendForce says a shortage of critical optoelectronic components — EML and CW lasers — is reshaping the AI optical transceiver supply chain, and projects the global market to grow from $16.5 billion in 2025 to $26 billion in 2026, an AI optical transceiver market up more than 57% year-over-year
- Applied Materials' Semiconductor Systems segment — the deposition, etch and inspection tools chipmakers install before fabricating a single AI chip — reported fiscal third-quarter 2026 revenue up 26.5% year-over-year to $7.04 billion in Applied Materials' Semiconductor Systems segment revenue
- Amkor Technology, the outsourced chip packaging and test house scaling up advanced packaging for AI processors, reported record second-quarter 2026 net sales of $1.90 billion, up 26% year-over-year $1.90 billion in record Q2 net sales, +26% YoY