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Modine Manufacturing, the thermal-management maker whose liquid-cooling systems keep hyperscale AI server racks from overheating, saw hyperscaler demand keep surging — first-quarter fiscal 2027 Data Centers segment sales reached $348.6 million in Data Centers segment sales, up 90% year-over-year
Verified 2026-09-03
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- Amkor Technology, the outsourced chip packaging and test house scaling up advanced packaging for AI processors, reported record second-quarter 2026 net sales of $1.90 billion, up 26% year-over-year $1.90 billion in record Q2 net sales, +26% YoY
- Every advanced AI chip needs packaging and testing before it ships, and ASE Technology, the world's largest outsourced semiconductor packaging and test house, is racing to add capacity for it. Equipment spending in its packaging and test segment jumped in the quarter to 30 June 2026, from $942 million a year earlier to $1.646 billion in ASE's advanced-packaging equipment spending, up 74.7% year-over-year
- Every advanced AI chip is printed on an ASML machine, and the company says AI demand has its customers accelerating their expansion plans. On 15 July 2026 ASML said it would lift its 2026 low-NA EUV capacity of around 65 systems, for 2027, by 30% more EUV machines a year