Nvidia's accelerators have pushed thermal design power from 700W for the H100 to over 1,000W for the B200 and B300, and air can no longer carry the heat away. TrendForce expects liquid cooling in server racks to reach 47% of server racks by 2026
TrendForce, a market research company, reported that the thermal design power (TDP) of AI processors is increasing, with Nvidia's H100 and H200 at 700W and the B200 and B300 exceeding 1,000W. This rise in heat output is driving the adoption of liquid cooling systems in server racks. TrendForce anticipates that the usage of liquid cooling in server racks will reach 47% by 2026.
Verified 2026-08-13
Track with InsiderWhy it matters
Air cannot cool the newest AI chips, so liquid cooling is becoming standard, helping firms that sell it.
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