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Supply chain6/day by emailEstimate
Every advanced AI chip needs 2.5D packaging before it ships, and TSMC's CoWoS lines have been the industry's tightest bottleneck. TrendForce expects the shortfall between what customers want and what TSMC can supply to ease as capacity ramps toward 200,000 wafers a month industry-wide, narrowing by the end of 2026 from TSMC's CoWoS supply-demand gap narrowing from about 20% to roughly 10% by the end of 2026
Verified 2026-09-05
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- Price
- $425.43
- 30D
- -4.51%
- AI share of revenue
- 58%
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