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Supply chainEstimate
Every advanced AI chip needs 2.5D packaging before it ships, and TSMC's CoWoS lines have been the industry's tightest bottleneck. TrendForce expects the shortfall between what customers want and what TSMC can supply to ease as capacity ramps toward 200,000 wafers a month industry-wide, narrowing by the end of 2026 from TSMC's CoWoS supply-demand gap narrowing from about 20% to roughly 10% by the end of 2026
Verified 2026-09-05
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More on Supply chain
- Amkor Technology, the outsourced chip packaging and test house scaling up advanced packaging for AI processors, reported record second-quarter 2026 net sales of $1.90 billion, up 26% year-over-year $1.90 billion in record Q2 net sales, +26% YoY
- Every advanced AI chip needs packaging and testing before it ships, and ASE Technology, the world's largest outsourced semiconductor packaging and test house, is racing to add capacity for it. Equipment spending in its packaging and test segment jumped in the quarter to 30 June 2026, from $942 million a year earlier to $1.646 billion in ASE's advanced-packaging equipment spending, up 74.7% year-over-year
- Every advanced AI chip is printed on an ASML machine, and the company says AI demand has its customers accelerating their expansion plans. On 15 July 2026 ASML said it would lift its 2026 low-NA EUV capacity of around 65 systems, for 2027, by 30% more EUV machines a year