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TrendForce reports TSMC is racing to keep up with AI chip orders from Nvidia, AMD and Broadcom -- monthly 3-nanometer wafer starts, already near 150,000 in the first half of 2026, could reach 180,000 wafers a month by early Q4 2026
Verified 2026-09-11
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- Every advanced AI chip needs packaging and testing before it ships, and ASE Technology, the world's largest outsourced semiconductor packaging and test house, is racing to add capacity for it. Equipment spending in its packaging and test segment jumped in the quarter to 30 June 2026, from $942 million a year earlier to $1.646 billion in ASE's advanced-packaging equipment spending, up 74.7% year-over-year
- Every advanced AI chip is printed on an ASML machine, and the company says AI demand has its customers accelerating their expansion plans. On 15 July 2026 ASML said it would lift its 2026 low-NA EUV capacity of around 65 systems, for 2027, by 30% more EUV machines a year