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SLC NAND flash contract prices rose an estimated 130% to 150% cumulatively in the first half of 2026 as supply tightened, according to TrendForce SLC NAND prices up 130-150% in H1 2026
Verified 2026-09-19
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More on Supply chain
- Applied Materials' Semiconductor Systems segment — the deposition, etch and inspection tools chipmakers install before fabricating a single AI chip — reported fiscal third-quarter 2026 revenue up 26.5% year-over-year to $7.04 billion in Applied Materials' Semiconductor Systems segment revenue
- Amkor Technology, the outsourced chip packaging and test house scaling up advanced packaging for AI processors, reported record second-quarter 2026 net sales of $1.90 billion, up 26% year-over-year $1.90 billion in record Q2 net sales, +26% YoY
- Every advanced AI chip needs packaging and testing before it ships, and ASE Technology, the world's largest outsourced semiconductor packaging and test house, is racing to add capacity for it. Equipment spending in its packaging and test segment jumped in the quarter to 30 June 2026, from $942 million a year earlier to $1.646 billion in ASE's advanced-packaging equipment spending, up 74.7% year-over-year