TrendForce projects the market for co-packaged and near-packaged optics — the technology replacing copper links inside AI data centers — will grow from about $100 million in 2025 to over $39 billion by 2030
TrendForce, a market research firm, projects the market for co-packaged optics (CPO) and near-packaged optics (NPO) will grow from approximately $100 million in 2025 to over $39 billion by 2030. This technology replaces traditional copper links in AI data centers to address limitations like signal loss and power consumption as data transmission speeds increase. The firm notes that growth is expected to accelerate sharply between 2028 and 2029 as scale-up architectures integrate optical interconnect technologies.
Verified 2026-09-21
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Light-based links are expected to replace copper wiring inside AI data centres, creating a new market for suppliers.
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