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TrendForce expects CoWoS-L to remain the mainstream advanced-packaging platform for AI chips through 2028, with Google adopting EMIB-T packaging and both AWS and Microsoft adopting CoWoS-L for their own AI chips in 2027, as Nvidia's high-end GPU shipments grow roughly 30% year-over-year in 2026 Nvidia's high-end GPU shipments growing about 30% year-over-year in 2026
Verified 2026-09-22
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