TrendForce expects CoWoS-L to remain the mainstream advanced-packaging platform for AI chips through 2028, with Google adopting EMIB-T packaging and both AWS and Microsoft adopting CoWoS-L for their own AI chips in 2027, and Nvidia's high-end GPU shipments growing about 30% year-over-year in 2026
This information comes from TrendForce's September 2026 research into advanced semiconductor packaging. The research indicates that CoWoS-L is expected to be the primary advanced packaging solution for AI chips through 2028. This is due to its technological maturity and yield advantages over competing solutions like Intel's EMIB-T.
Verified 2026-09-22
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How AI chips are packaged decides who supplies them, and cloud firms are choosing between rival methods.
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