Micron plans to add up to 60,000 HBM wafers per month of capacity, reaching roughly 100,000 wafers/month by end-2026, per TrendForce -- still far below Samsung's and SK hynix's respective ~150,000-200,000 wafers/month
Micron's HBM capacity is projected to reach approximately 100,000 wafers per month by the end of 2026, according to TrendForce. This expansion involves adding up to 60,000 HBM wafers per month. Industry estimates cited by ETNews indicate that this capacity would still be below Samsung's and SK hynix's respective HBM capacities of around 150,000-200,000 wafers per month each.
Verified 2026-09-18
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Micron is expanding AI memory output but remains smaller than its two main rivals in this market.
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