High-bandwidth memory is taking over the memory industry's capacity: TrendForce expects HBM to account, among the top three DRAM suppliers by the end of 2026, for 22% of DRAM wafer input, up from 18% a year earlier
TrendForce, a market research company, estimates that high-bandwidth memory (HBM) is taking a growing share of DRAM wafer input among the top three DRAM suppliers. It projects the share will rise from 18% at the end of 2025 to 22% at the end of 2026, and to 30% by the end of 2027. TrendForce describes HBM as a core memory component for AI training and inference infrastructure.
Verified 2026-08-08
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Memory makers are shifting factories towards AI memory, which can leave less for phones and PCs.
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